对于许多一直
期待着
PS3轻薄化的玩家来说，下面这个消息无疑相当激动人心。索尼在新型号
PS3上将使用新的散热技术，准确的说应该是新的散热装置，这将有助于进一步降低
PS3的重量和体积，同时实现结构设计上的优化。
根据Next Generation的报道，日本古河电子公司（Furukawa Electric）日前公布了专门面向PS3设计的第3代散热装置，重量比首发版时的PS3减轻了近50%，不同零部件数量由最初的20个减少到了现在的3个。
当然，散热装置的简化与PS3芯片的进一步小型化是不能分开的，但这一突破从工业设计角度来说对索尼无疑有着重要的意义。对于普通玩家来说，对PS3腰围继续缩小、体重继续降低、身材更加性感的期望，也随着主机结构简化变得不再遥远。
http://www.levelup.cn/news/NewsDetails/2008-4-26/28276.shtml引用:
Lighter, More Efficient PS3s in the Works
A new PS3 heat sink that will reduce the weight of the console and increase system efficiency is in development.
Furukawa Electric exhibited the “third generation” PS3 heat sink at Techno-Frontier 2008 in Japan earlier this month, reports TechOn. The heat sink is characterized by its small size, light weight and low cost.
The report says that separate heat sinks will for the first time be used to cool the PS3’s Cell microprocessor and RSX graphics chips. The separate heat sinks will weigh in at about 350g in total, in comparison to 700g and 500g for the first and second designs used in PS3s.
Furukawa Electric says it has managed to remove a number of components from the older heat sinks, including copper heat pipes, without reducing heat radiation performance. The new heat sink will feature only three types of components, while more than 20 were featured in first generation PS3 heat sinks and about 10 in the second.
Earlier this week analysts at the wholesale investment bank Nikko Citigroup said they expected Sony to begin making a profit on PlayStation 3 units from August. It has been speculated that profit-making PS3s will likely feature sub-65nm cell processors, sub-90nm RSX graphics chips, or both, since the smaller chips are cheaper to manufacturer.
The size reduction of PS3 components could lead to the introduction of the rumored PS3 Slim down the line, and also to potential hardware price cuts.
http://www.next-gen.biz/index.php?option=com_content&task=view&id=10172&Itemid=2
